Electromigration in Metals

Electromigration in Metals

Fundamentals to Nano-Interconnects

Ho, Paul S.; Sukharev, Valeriy; Hu, Chao-Kun; Gall, Martin

Cambridge University Press

05/2022

430

Dura

Inglês

9781107032385

15 a 20 dias

980

Descrição não disponível.
1. Introduction to electromigration; 2. Fundamentals of electromigration; 3. Thermal stress characteristics and stress induced void formation in aluminium and copper interconnects; 4. Stress evolution and damage formation in confined metal lines under electric stressing; 5. Electromigration in Cu interconnect structures; 6. Scaling effects on microstructure and resistivity of Cu and Co nanointerconnects; Analysis of electromigration induced stress evolution and voiding in Cu damascene lines with microstructure; 8. Massive scale statistical studies for electromigration; 9. Assessment of electromigration damage in large on-chip power grids. Index.